It can be used for rework, sphere or pin attachment to BGA, PGA, and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reball. Excellent capacity of solder-stickiness Excellent Anti-wet Capacity Widely used on BGA, PGA, CSP packages, and flip chip operation Suitable for multiple PCB reflow No-clean and Lead-free for environmental protection

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